CN

Designed to the OCP Dual standard, the LM5020 DM.2 connects two M50 chips through a high-speed interconnect. Built for complex edge scenarios, its dual-chip architecture supports the private deployment of large models with hundreds of billions of parameters and enables multimodal AI agents to run locally. With doubled computing power and expanded memory capacity, it provides a high-performance foundation for edge AI.

Specifications
Dimensions
46×80mm
Interfaces
PCIe Gen4 ×8, M.2 M-Key
AI Accelerator
2× MOMAGIC ® 50
Physical Computing Power
320 TOPS @INT8
200 TFLOPS @bFP16
Typical power consumption
≤ 26W
Memory Capacity
24 GB 192-bit LPDDR5, supporting a maximum of 96GB
Memory Bandwidth
307 GB/s
System Support
Win11 / Linux / Android
Software Support
Houmo Dadao™️ Software Platform
Power Management
Multi-level power consumption modes, ultra-low power standby as low as 8mW
Operating Temperature
0-50℃
Cooling Solution
Custom heatsink, supporting active cooling / passive cooling
Specifications
Dimensions
46×80mm
Interfaces PCIe
PCIe Gen4 ×8, M.2 M-Key
AI Accelerator
2× MOMAGIC ® 50
Physical Computing Power
320 TOPS @INT8,200 TFLOPS @bFP16
Typical power consumption
≤ 26W
Memory Capacity
24 GB 192-bit LPDDR5, supporting a maximum of 96GB
Memory Bandwidth
307 GB/s
System Support
Win11 / Linux / Android
Software Support
Houmo Dadao™️ Software Platform
Power Management
Multi-level power consumption modes, ultra-low power standby as low as 8mW
Operating Temperature
0-50℃
Cooling Solution
Custom heatsink, supporting active cooling / passive cooling